Solder Bump Plating DuPont
Production-proven Electroplating Chemistries for Wafer Level Packaging DuPont Electronics and Imaging’s award-winning Solderon™ BP electroplating chemistries are reliable alternatives to tin-lead alloys for all wafer bumping applications, from standard C4 solder bumps to capping sp.info Semiconductor Packaging Materials - DuPontA Broad Portfolio of Materials for All Types of Advanced Semiconductor Packages With more than 50 years invested in technology development, DuPont Electronics & Imaging understands the needs in the market and has developed a broad portfolio of semiconductor packaging materials for a range of technology areas.sp.info Permanent Bonding Materials DuPontDuPont Electronics & Imaging’s family of adhesives and dielectrics provide leading-edge permanent bonding materials solutions to meet key requirements for today’s high-density, thinner packages used in mobile products and high-performance computing. Photo-patternable dielectrics to bond chips requiring specific structuressp.info DuPONT ELECTRONIC MATERIALS Kayaku Advanced dupont electronic materials Kayaku Advanced Materials, Inc.’s partnership with DuPont Electronic Materials spans over 25 years. It is a relationship that integrates distribution, licensing, and value-added services in semiconductor and advanced packaging electronic materials — from front end to back end.
Through Silicon Via Copper (TSV) DuPont
Packaging Dielectrics Through Silicon Via Copper Years of experience and success in electroplating damascene copper have helped DuPont bring leading-edge copper TSV chemistries to the advanced packaging market.sp.info Smart Packaging – InsulectroDuPont 5018 A UV-curable, highly cross-linked screen printable blue dielectric. When cured this product provides an excellent solvent and moisture barrier withsp.info Next Generation Photosensitive Dielectric Materials for Hitachi Chemical DuPont MicroSystems (HDMS) is a supplier of photosensitive negative-tone polyimides (PI) and positive-tone poly (benzoxazole)s (PBO) for use as protection layers in semiconductorsp.info Polymer Challenges in Electronic Packaging:Part 8 Dec 09, 2013 · HD Micro Systems (Hitachi/DuPont) supplies the majority of the polyimide and also sells PBO. Toray and Asahi Kasei also provide polyimides to the packaging market. An interesting distinction between a photoresist and the photo-sensitive polymer dielectrics used in eWLP is that the redistribution layers are a permanent part of the package structure.
Recent progress in low temperature curable photosensitive
Apr 22, 2017 · Currently, dielectrics for FOWLP applications are cured at around 230°C. However, even lower cure temperatures are now required due to the limitations in heat resistance of packaging materials, a reduction in warpage of re-constituted wafers sp.info Polymers in Electronics Part Six:Redistribution Layers May 01, 2017 · The first dielectric materials for fan-out were photosensitive polyimides such as HD 4100 (HD Microsystems, a joint venture between Hitachi Chemical and DuPont). HD 4100 is a negative tone photo-imageable dielectric.sp.info Partnership with DuPont Electronic Materials Kayaku A Broad Range of Products to Serve Your Needs . Kayaku Advanced Materials’ partnership with DuPont Electronic Materials spans over 25 years. It is a relationship that integrates distribution and licensing of DuPont, Shipley semiconductor and advanced packaging electronic materials, and value-added services founded in Kayaku Advanced Materials’ chemical and formulary knowledge, applications sp.info MF-319 Kayaku Advanced Materials, Inc.200 Flanders Road Westborough, MA 01581 USA Tel:617-965-5511
Lighting – Insulectro
Lighting Demand for brighter, more efficient LED light sources is challenging solid-state lighting designers. The widespread adoption and use of LEDs has required the use of highly reflective inks along with the need to attach components to existing flexible circuitry with a robust connection not only for conductivity but also for strength and flexibility.sp.info Dielectrics for Power Electronics ApplicationsDielectrics for Power Electronics Applications Author:Paul Paret Subject:This presentation discusses the role of dielectric materials in power electronic packages. Two dielectric technologies - a dielectric material film-based substrate for insulation and a dielectric coolant - are discussed.sp.info DuPont 4922N – InsulectroThis product is a higher viscosity version of DuPont 4817N that can be applied via brush, stylus or applied using matching banding. This is an air dry/forced heat thermoplastic composition that provides excellent conductivity and adhesion to a variety of surfaces such as plastic, paper, wood, film, rubber and ceramic substrates for plating.sp.info PH-745 Phosphor Binder Kayaku Advanced Materials, Inc.200 Flanders Road Westborough, MA 01581 USA Tel:617-965-5511
Drew Chambers - Marketing Director - DuPont LinkedIn
View Drew Chambers’ profile on LinkedIn, the world’s largest professional community. Drew has 5 jobs listed on their profile. See the complete profile on LinkedIn and discover Drew’s sp.info Electronics Packaging - an overview ScienceDirect TopicsJames J. Licari, Dale W. Swanson, in Adhesives Technology for Electronic Applications (Second Edition), 2011 1.1.2 Classification by polymer or chemical type. Adhesives are often referred to by their polymer type. The major polymer types used in electronics packaging are epoxies, silicones, acrylics, polyurethanes, polyimides, and cyanate esters. Some generic properties apply to each type but sp.info